Friday, July 26, 2024

HBM Market and Revenue (FMS 2024 Presentation)

 

HBM Memory Market at FMS 2024

Jim Handy and I are presenting at FMS (Future of Memory and Storage) on HBM market, AI datacenters and scenarios on what the future holds.

 

“Is HBM Memory Headed to New Heights, or is it just Hype?”

DRAM-103-1: Influence of AI on Memory Technology, Tues 3:10-3:40

Spoiler alert: There is a lot of hype and it is heading to new heights

We show the impact of AI on the HBM market, Multiple forecasts, and memory scenarios that happen with new and fast growing markets

 

 

Some Recent Data:

  • HBM current market revenue estimates are 3B-20B+ per year (see graph)
  • HBM revenue growth is forecast at 25% CAGR to 150%+ CAGR  
  • NVIDIA revenue is growing at astounding rates. But other companies not so much
  • Hyperscalers are spending TONs of money on AI servers AND still buying more traditional servers than 2023
  • HBM bit price is ~6x DDR memory.  Bit cost is ~3x DDR Memory.  


Some Forecast Challenges:

HBM is now competitive. Solutions from Micron and Samsung joined Hynix dominance. Hynix recent earnings report shows they still are the largest supplier by far and are not planning to give up share

Competitive memory leads to cyclical shifts. This is due to lead times, factory builds, and inventory

  • During hypergrowth, everyone over orders to cover possible growth. 
  • Cutting CAGR by half (not even flat) will lead to Inventory going from 4 weeks to 20+ weeks. Then, most orders stop and the price drops. 
  • The larger the forecast growth, the larger the problem

Update on Forecasts: 

We pulled recent forecasts from sources and compared them. We will discuss in more detail at FMS

(The identities of the analysts ... Including myself and Jim...  are being protected for now)




We definitely underestimated HBM sales in 2023 and 2024. We increased the forecast based on Q2 results. The forecasts show growth from everyone.

Regardless of growth of 50% or 150%, we would expect some correction sometime. Datacenter digestion, overproduction, pricing causing demand destruction, Price war among producers. We will discuss when, how much, and who might win the battle long term

 

Mark Webb

www.mkwventures.com




Wednesday, July 24, 2024

Intel Capacity by Fab Through 2030 (MKW VENTURES CONSULTING)

 

UPDATED: Intel Fab Capacity Expansion Scenarios (Option A)

One potential scenario based on our model and changes to capex and timing in last 6 months.

  • Fab 52 runs production in 2026, Fab 62 year after
  • Ohio starts production in 2028
  • After delays, this is aligned to graph shown by technology at Foundry Day
  • Assumes EUV tools installed in ~2026 in some 10/7 Fabs to support 4/3 Ramp.
  • *We add new issues to monitor given the Intel restructuring 
  • *Also what is the plan for 20A and Arrow Lake? Can they ramp another Fab?

  • 20A/18A/14A fabs are D1+Fab52+Fab62+OHIO in this model




We have addition scenarios based on TSMC use and whether Intel Foundry starts to ramp. This is especially important to track given Intel's restructuring

Also we can discuss cost and revenue by Fab... including JV SCIP impact

Call or text to discuss.

We will be a Future of Memory and Storage (FMS) in Santa Clara Aug 5-8



Mark Webb





New and Emerging Memory Technology Status/FMS 2024

 

Status of New and Emerging Memories (Mark Webb, MKW Ventures Consulting LLC)

We have a Future of Memory and Storage/Flash Memory Summit Paper that we are presenting showing how chiplets change the equation on adding different types of memory to products. It allows designers to trade off cost and performance characteristic with more knobs. MRAM, NOR, DRAM, all on the same chip in the desired proportion with different processes.

Our presentation is “Memory Technologies : How Chiplets Change Everything”

FMS OMEM-203-1 Heterogeneous Solutions for Performance Session - Wed Aug 7, 3:00pm - 4:05pm Ballroom C

 

That said, we need to reiterate the opinion, backed by data, that emerging memories will not emerge to any material impact on the DRAM or NAND Market. Unlike some peoples predictions, the emerging memory market will not be $30B or even $3B in the next 5-10 years. It is well below $300M today

 

Emerging memories are possible in 3 areas:

  • Niche products (which we will show can be integrated in a chiplet product)

  • Embedded In a foundry process from TSMC or Global or Intel

  • High volume  IF they require minimal (<10% of steps) changes to a NAND or DRAM flow.

 

Fourth Option:  They stagnate due to technical issues and lack of demand.


Costs for Memory Technologies




Quick Summary:

MRAM (STT): Available today. In embedded, replacement for E-flash if you need advanced process and embedded memory. Niche applications as discrete. Those applications will increase with chiplet use.

RRAM: Available today. May scale differently than MRAM and typically is slower. But has applications depending on cost scaling. Embedded, Chiplets, Niche applications. Some AI weighting use

PCM (1T1R): Available today.This is lower density (<1Gbyte). A technology that 50+ years old …. Typically used by companies who love PCM (ST, IBM, Micron) as they have decades of history of characterization.

Crosspoint technologies (1TnR): Optane fully developed the worlds best and most dense “faster than NAND, cheaper than DRAM” technology. The economics didn’t work and the demand was 10x lower than anticipated. Intel and Micron gave it a huge effort and we all appreciate the attempt. It’s not clear how to get these technologies to high volume IF they worked well.

FeRAM (high density): Was a potential future due to ability to integrate with DRAM flow. However all memory companies worked extensively on Hf based FeRAM products since 2020 and none were productized due to a variety of reasons.

Other New Materials: UltraRAM, New PCM materials, New RRAM materials/companies etc: These are possible but are 10 years from potential production. Unless implemented with 3D DRAM in 2028-2030, these are lower probability at this point. Our presentation on our website of  “Memory technology Product Lifecycle” give detailed timeline of how new memories come to production

 

Summary: There is no universal memory coming. We have SRAM, DRAM, NAND, NOR, MRAM, RRAM, PCM available today. Lets focus on integrating those as embedded or in chiplets.


I will be in Santa Clara Aug 5-8. Call or text to set up meetings at FMS or by Zoom. We will host some Zoom sessions during the conference timeframe. I can address all of the technologies one by one with costs and applications

Lots More info on our website www.mkwventures.com


Mark Webb

MKW Ventures Consulting LLC

www.mkwventures.com